0
0
The Honor Magic V6 leak has confirmed major specifications of the upcoming foldable smartphone just days before its expected global unveiling at MWC 2026. Screenshots shared by a known Weibo tipster suggest that Honor is preparing two variants of the device, featuring larger batteries, next generation processing power, and satellite connectivity support.
The device is expected to debut globally on March 1 during the upcoming edition of Mobile World Congress in Barcelona.
Two Model Variants Surface Online
According to leaked screenshots circulating on Weibo, two model numbers have been identified:
-
PNM AN10
-
PNM AN20
The PNM AN10 is believed to be the standard model, while the PNM AN20 variant is expected to include Beidou satellite connectivity. This addition places the device among a limited number of foldables offering satellite communication features aimed at users in remote or low signal areas.
If confirmed, this would expand connectivity options beyond traditional cellular networks.
Significant Battery Upgrade
Battery capacity appears to be one of the biggest upgrades highlighted in the Honor Magic V6 leak.
-
Standard variant: 6850mAh
-
Satellite variant: 7150mAh
Both configurations represent a major increase over the previous model, the Honor Magic V5, which launched with a 5820mAh battery in July 2025.
Such capacity improvements could position the Magic V6 as one of the longest lasting premium foldables on the market, addressing a common concern among foldable phone users regarding battery endurance.
RAM and Storage Configurations
The leak suggests the following memory and storage options:
-
16GB RAM with 512GB storage for the standard model
-
12GB RAM with 256GB storage for the satellite model
Additional configurations may be introduced at launch, but these two variants are the only ones confirmed in the current leak.
Display Specifications
The Honor Magic V6 leak also outlines display resolutions for both screens:
-
Inner display: 2352 × 2172 pixels
-
Outer display: 2420 × 1080 pixels
These specifications align with other flagship foldables from brands like Samsung and Oppo, which focus on high pixel density and seamless transitions between cover and main screens.
While refresh rate details have not been confirmed, the resolution suggests a continued focus on premium display quality.
Snapdragon 8 Elite Gen 5 Expected
Powering the device is reportedly the Snapdragon 8 Elite Gen 5 chipset, signaling a generational upgrade in performance and efficiency.
The chipset is expected to deliver improvements in AI processing, gaming performance, and power management compared to previous Snapdragon flagship processors. This would make the Magic V6 competitive among top tier Android foldables launching in 2026.
Custom Honor Chips for Connectivity and Power
The leak also references two in house Honor chips:
-
Honor C1 Plus for RF signal enhancement
-
Honor E2 for power management
This reflects a growing industry trend where manufacturers supplement third party processors with proprietary silicon to optimize specific functions. Similar approaches have been seen from major brands developing custom chips for efficiency and connectivity improvements.
Software: MagicOS 10 Based on Android 16
Software details indicate that the device will run MagicOS 10 built on Android 16. If officially confirmed at launch, the Magic V6 could be among the first foldable smartphones to ship with Android 16 out of the box.
This may bring improved multitasking capabilities, enhanced foldable UI optimization, and updated privacy features.
Official Announcement Expected at MWC
Honor has not yet officially confirmed these specifications. Full details, including pricing and regional availability, are expected during the global reveal at Mobile World Congress on March 1.
Until then, the Honor Magic V6 leak provides a strong indication that the upcoming foldable will focus on battery capacity, next generation processing power, and expanded connectivity features.
PLEASE CLICK HERE FOR MORE NEWS
